Innovate Beyond Limits | Axis-Tec @ SEMICON SEA 2026
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Event Overview
SEMICON Southeast Asia 2026 will be held at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, Malaysia, from May 5 to 7, 2026.
AXIS-TEC, a subsidiary of Yanmade, will be located at Booth #2114, 2nd Floor, MITEC. We sincerely welcome you to visit and communicate with us.
As an annual flagship event for the semiconductor industry in Southeast Asia, the exhibition gathers leading enterprises across the global semiconductor industrial chain, tens of thousands of professional buyers and industry decision-makers. It fully covers core segments including wafer fabrication, packaging & testing, and intelligent manufacturing, and has become a vital platform for the industry to capture regional trends, connect global resources and expand the ASEAN market.
Gather in Southeast Asia
Our professional technical team will introduce Axis-Tec’s latest advancements in silicon photonics wafer inspection at the booth. Combining industry trends and practical applications, we will conduct in-depth discussions on potential cooperation opportunities.
We look forward to seizing development opportunities in the Southeast Asian semiconductor industry together with industry partners via this platform. New and long-term friends are warmly welcome to visit our booth to exchange insights on industry development and future collaboration.
About Axis-Tec Pte. Ltd.
Axis-Tec, founded in 2004 and headquartered in Singapore, focuses on customized automated manufacturing, testing and assembly systems. We provide wafer-level test, micro-assembly and test automation solutions integrating precision mechatronics, advanced vision and customized software, helping clients improve quality, efficiency and full-process traceability.
Upholding the motto Do it right. Make it different., we offer end-to-end services from design to commissioning, serving semiconductor, automotive, aerospace, medical, consumer electronics and research institutions across Asia. Our core offerings include wafer-level AOI defect inspection and automated final test systems for IMU and TPH calibration modules, enabling customers to build integrated test lines from wafer to packaging stage.
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