Hyperspectral Image Sensor CMOS图像传感器

品牌 Teledyne DALSA 达尔萨

分类 CMOS图像传感器

  • 产品详情
  • 附件下载

Teledyne DALSA is pleased to offer new and expanded VNIR (visible to near infrared) hyperspectral image sensor capability for remote sensing applications, such as environmental observation, defense and security and other earth observation applications.","DALSA’s custom products group is able to offer a number of new technologies to enable the latest improvements in hypersepectral imaging. In hyperspectral imaging the incoming light signal is divided into bands that can span as little as a mere 10nm; the more sensitive the sensor the greater its ability to produce useful information. More and more critical environmental information is available with the latest sensor technologies available from DALSA. Key attributes to developing leading edge hyperspectral imaging are: ultra high quantum efficiency, back side thinning, high speed read rates, low defects and advanced packaging techniques.","DALSA is able to offer both CCD and CMOS detectors. CCDs are ideal where ultra low noise is preferred and CMOS where low power and high data\/frame rates are more important. Typical requirements in hyperspectral imaging require back side thinning in order to get the highest quantum efficiency due the spreading of the incoming light sensor over many pixels. In addition to back side thinning custom anti-reflection coatings further broaden the quantum efficiency in the VSNIR (visible to near IR) range.","With the fabrication possibility of ever smaller pixels (down to 4 microns square) high resolutions are obtainable and advanced architectures like split frame frame transfer enable high dynamic range with low crosstalk or blurring. In CMOS the use of partial region readout can enable the highest intra scene dynamic range. Multiple cost effective package choices are available with hermetic sealing. Designs are available for radiation hardness for extreme environments.

特性

  • 多区域单片高光谱成像仪
  • 推扫线性和tdi传感器,x分辨率达到12000+像素,y分辨率不受限制
  • 背面照明(bsi)选项,最大灵敏度和qe
  • 抗反射涂料优化qe
  • 辐射耐受性/硬度
  • 丰富的包装经验
  • 单片高光谱成像仪——在一个芯片上有多个不同的成像区域
  • 优化QE的减反射涂层

技术参数

规格项参数值
阵列类型Linear Array
水平像素12000 Pixels
封装形式Hermetic Sealed
产品类别CMOS Image Sensors
图像传感器类型Color
温馨提示

若上述内容存在差异,请以产品手册为准。

如需获取样品、技术支持或完整规格书,请点击联系销售。

声明:本产品内容及配图源自互联网收集或平台用户自行上传,目的在于传递更多信息,并不代表本网赞同其观点或证实其内容真实性,不承担此类作品侵权行为的直接责任及连带责任。如涉及作品内容、版权等问题,请联系本网处理,侵权内容将在一周内下架整改。

分享
收藏
拨打电话
立即沟通

1.点击右上角

2.分享到“朋友圈”或“发送给好友”

×

微信扫一扫,分享到朋友圈

推荐使用浏览器内置分享功能

  • #{subject}
    #{size}
    下载