特性

• 单片多光谱成像仪——在一个芯片上有3、4、5个或更多不同的成像区域
• 推扫线性和tdi传感器，x分辨率达到12000+像素，y分辨率不受限制
• 用于光谱灵敏度和分离的高级滤光片和涂层（分色、有机和更多）
• 背面照明（bsi）选项，最大灵敏度和qe
• 辐射宽容/硬度
• 丰富的包装经验
• 公差/辐射硬度

Teledyne DALSA is pleased to offer new and expanded VNIR (visible to near infrared) multispectral image sensor capability for remote sensing applications, such as environmental observation, defense and security and other earth observation applications.","DALSA’s new multispectral imaging solutions leverage our long experience in leading edge design, fabrication and packaging technologies to achieve multispectral sensitivity in a single fully miniaturized package. A single device can contain multiple imaging areas tailored to different multispectral bandwidths in a highly cost effective and reliable package. By placing advanced dichroic filters applied directly in the imaging DALSA delivers highly efficient multispectral sensors.","DALSA is able to combine advanced filter technology with the highest resolution sensors available; >12,000 pixel linear arrays are easily achieved. In addition each imaging area on the device can be designed to have its own pixel size and clocking to enable optimal imaging performance for the individual spectral bands. Individual elements are typically based on DALSA’s industry-leading high resolution Time Delay and Integration technology (TDI) to maximize sensitivity and throughput. For ultimate sensitivity we also offer back side illuminated (BSI) devices. DALSA’s custom BSI process can optimized to achieve nearly 100% quantum efficiency thereby achieving signal to noise ratios that at the theoretical maximum.","DALSA also offers advanced packaging options; our experience with designs optimized for radiation hardness and extreme environments gives our customers confidence and competitive advantage.

技术参数