特性

• In-tank, real-time process control
• Accurately monitors inorganic and organic bath components
• Fast, accurate analysis (Approx. 15 min. for 6 components with early fault detection capability)
• Worldwide technical support
• Full closed-loop integration capability with major plating tools
• Virtually no maintenance with low cost of ownership
• Small footprint
• Simple installation

"The RTA is an automated, on-line, real-time, and in-tank system for monitoring and controlling the levels of chemical constituents of plating baths.","The RTA technology is a unique modern approach to metrology combining the advanced, purpose-selected electroanalytical techniques with state-of-the-art chemometric techniques. This patented analytical technique utilizes a combination of both AC and DC voltammetry to precisely measure both organic and inorganic levels. Plating performance becomes consistent yielding a constant optimum deposit.","RTA is the most advanced process control technology for copper electrodeposition available in today's market offering accurate analysis of commercial processes from Enthone OMI, Dow Chemicals, Technic, and others."

技术参数