特性
- 没有接触传感
- 1毫米孔径
- 高集成电路(上)
- pcb安装
- 达灵顿输出
- 无接触感应
H21BX产品由一个红外光发射二极管耦合到封装在注塑成型外壳中的NPN硅光达林顿。该包被设计为优化机械分辨率，耦合效率，环境光排斥，和可靠性。当LED工作时，在缝隙中插入/移除不透明材料，开启/关闭达灵顿灯。"，"特性:
技术参数
| 规格项 | 参数值 |
|---|---|
| Width | 0.2500 inch (6.35 mm) |
| Operating Temperature | -67 to 212 F (-55 to 100 C) |
| Product Category | Photoelectric Sensors |
| Operation Distance | 0.1181 inch (3 mm) |
| Power Requirements | DC Powered |
| Height | 0.4331 inch (11 mm) |
| Optical | undefined |
| Electrical Output | Switched / Alarm |
| Body Shape | Slot |
| Optical Technology Type | Through Beam |
| Dimensions | undefined |
| Specifications | undefined |
| Electrical | undefined |
| Length | 0.9724 inch (24.7 mm) |
| Beam Type | Infrared |
